Qnity Electronics introduced two new memory cooling solutions based on its Laird Graphite-over-Foam (GOF) and Laird Thermal Interface Material (TIM) technologies. The solutions are designed for DDR5 DIMM memory modules…
Qnity Electronics launches ultra-thin flex circuit materials for smart consumer devices
October 12, 2026
Qnity Electronics (NYSE: Q) has introduced ultra-thin flex circuit materials built on Kapton polyimide films and Pyralux flexible laminates for smartphones, AI glasses, and AR/VR devices. The portfolio is aimed…
Qnity Electronics introduced Kalrez 7080 perfluoroelastomer sealing parts, engineered for semiconductor processes operating at temperatures up to 330°C. In internal thermal-aging evaluations over 672 hours of air exposure at temperatures…
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