Henkel launches Loctite ABLESTIK CDF 900 conductive die attach film series

Henkel Adhesive Technologies has launched Loctite ABLESTIK CDF 900, a next-generation conductive die attach film (cDAF) series with thermal conductivity above 8 W/m-K. The film targets semiconductor packaging for AI, 5G and emerging 6G telecommunications, and high-performance computing, including large-die processor and AI chip packages. The company says its film format avoids material bleed-out and non-uniform bondline thickness seen with competing liquid die attach adhesives.

Key facts

Market context

Die attach materials bond semiconductor chips to their substrates or lead frames and carry heat and electrical signals away from the device. Conductive die attach films are a sheet format of this adhesive chemistry, typically based on epoxy or acrylic resin systems loaded with metal or ceramic fillers that raise thermal and electrical conductivity. Demand for these materials is driven by advanced packaging for artificial intelligence accelerators, high-performance computing processors, 5G and emerging 6G telecommunications hardware, mobile devices, automotive electronics and power devices, where heat removal and bondline control increasingly limit performance. Film formats differ from liquid dispensed adhesives because they are pre-formed to a set thickness, which helps manage bleed-out and bondline uniformity on large dies. Suppliers of semiconductor packaging materials compete on thermal performance, process compatibility and reliability, so new product series can shift qualification activity among assembly houses and chip designers.

Source: official release on henkel.com. Summary and context written by Market Krystal.