Tokuyama opens semiconductor-grade polysilicon crushing plant in Vietnam

Tokuyama Corporation held an opening ceremony on August 13, 2026, for a new semiconductor-grade polycrystalline silicon plant operated by its wholly owned subsidiary TOKUYAMA VIETNAM CO., LTD. (TVC) in the Phu My 3 Special Industrial Park in Ho Chi Minh City. The plant will serve as a key overseas base for crushing and cleaning polycrystalline silicon, with trial operations and quality verification to follow. TVC capital is 580,000 million Vietnamese Dong.

Key facts

Market context

Polycrystalline silicon is the feedstock from which single-crystal silicon ingots and wafers are grown, making it the foundation of nearly all semiconductor chips and solar cells. Semiconductor-grade material must meet very low levels of metallic and carbon impurities, so the crushing and cleaning steps that size and purify the material before it reaches wafer makers are specialized and tightly controlled. Demand for these processing services is driven by logic and memory chip production, power electronics, and the broader electronics supply chain, which has been expanding in Southeast Asia as manufacturers diversify their footprints. Adding downstream processing capacity closer to wafer producers can shorten logistics chains and give buyers an additional qualified source alongside established Japanese production. For buyers, the key questions are typically qualification timelines and quality consistency, which usually take time to verify after a new plant starts operating.

Source: official release on tokuyama.co.jp. Summary and context written by Market Krystal.